Automatic Gantry-Type Dip Soldering Machine

DSW-SDRF-V
Applications

[Gantry-type Versatile Soldering Unit: DSW-SDRF-V Balancing Ultimate Safety and Precision]
The DSW-SDRF-V Gantry-type Automatic Soldering Machine offers exceptional versatility with its stable gantry structure and 0~270° rotary positioning technology. Featuring a unique automated shuttle system, it allows operators to change fixtures safely in the loading zone, staying isolated from high-temperature solder pots for maximum industrial safety. Whether processing micro SMD components and relays or large-scale transformers and inverters, the DSW-SDRF-V delivers high-speed, high-precision, and multi-angle automated soldering, providing the most reliable soldering solution for electronic components of all sizes.

High Frequency Transformer Coil DIP Soldering

High Frequency Transformer

Common Mode Choke Coil Filter DIP Soldering

Common Mode Choke

CFL Ballast Inductor Choke Coil Component Soldering

CFL Ballast Inductor

Inverter Power Inductor Energy Storage Transformer Soldering

Inverter Power Coil

Electronic Transformer Coil DIP Through-hole Soldering

Electronic Transformer

Feature

Gantry-Type Automated Precision Soldering Solution:

The DSW-SDRF-V combines a stable gantry structure with 0~270° rotary positioning, offering exceptional versatility. Featuring an automated shuttle system, it allows safe fixture changes for both micro-components and large power modules, delivering high-precision, 360-degree automated soldering for products of all sizes.

  • Servo Precision Drive: Servo motor with ball screw ensures fast, precise, and stable movement.
  • Extended Rotation: 0~270° servo-controlled rotation allows for complex multi-angle positioning.
  • Flux Fountain Design: Ensures a stable surface level and precise control of flux specific gravity.
  • Anti-Tip Function: Integrated rotation angle soldering effectively eliminates tin-tip issues.
  • Multi-Stage Efficiency: Allows dipping of two sides in a single cycle with independent timing setup.
  • Dual-Tank Stability: Main and auxiliary slot design provides superior stability during soldering.
  • Auto Solder Leveling: Integrated detection sensors with auto-refill maintain a consistent tin level.
  • Industrial HMI: Touch panel with 10-set program memory and password-protected management.
Technical Specifications
Solder time Depending on the size of the coil and wire diameter Production capacity Row-type tooling, depending on the size of the coil
Solder Pot Dimensions 45 mm x 180 mm (Adjusted according to product) Lift scale Min. 0.01 mm
Lift range Max. 80 mm Rotation scale Min. 0.1°
Rotation range Max. 360° Rotation available range +/-180°
Machine power Max. 2.8 kW (Depending on specifications) Machine current Max. 12.7 A (Depending on specifications)
Heater Spec. 1000 W x 2 (Adjusted according to product) Solder Pot power Max. 2.0 kW (Depending on specifications)
Solder Pot current Max. 9.0 A (Depending on specifications) Solder Pot temp. Max. 500 °C
Control System PLC Power Supply 1Φ 220 Vac | 50 ~ 60 Hz ±1%
Air Requirement 0.4 ~ 0.6 MPa Machine weight 350 kg ±10
Machine dimensions 1325(L) x 900(W) x 1910(H) mm
Optional Accessories
CE certification
Safety Guard
Tin surface detection mechanism
Tin feeder mechanism