Air-Coil Series Automatic Winding Machine

DSW-0001P
Applications

The DETZO DSW-0001P is a precision winding machine specifically designed for self-bonding coils, compatible with both alcohol-based and hot-air-type bonding wires. This equipment specializes in the precision winding of IC card coils, smart card coils, and various bobbinless air-core coils. Featuring advanced molding control and precise heating/alcohol-dampening systems, the DSW-0001P ensures rapid solidification and superior dimensional accuracy after winding. It is the high-efficiency choice for the production of smart identification components requiring exceptional quality.

Various self-adhesive coils

Suitable for-self-adhesive coils

IC card coil

IC card coil

IC card coil

IC card coil

Bobbinless coil

Bobbinless coil

Bobbinless coil

Feature
High-Efficiency Automated Winding: Integrating Keyence systems with AC servo motor drives to achieve extreme positioning accuracy. Featuring unique quick-change tooling design and 120-program memory, this solution significantly reduces downtime and enhances production flexibility for modern industrial environments.
Exact Positioning: Combines Keyence control with AC servo drives to ensure millisecond-level precision.
Dialogue HMI: 10" large interface with conversational programming for intuitive and effortless setup.
Quick Changeover: Unique winding tooling design allows for rapid swapping to accommodate diverse products.
Mass Storage: Stores up to 120 programs, enabling fast style switching and reduced changeover time.
Security Logic: Hierarchical access and password protection prevent unauthorized modifications to maintain integrity.
Simplified Maintenance: Robust mechanical structure with easy controls for minimal operational overhead.
Technical Specifications
No. of Spindle
Single Spindle
Spindle Speed
Max 3000 rpm (CW/CCW)
Wire Diameter
Ø0.10 ~ Ø0.50mm
Control System
PLC 6-axis control
Nozzle Movement X: 40 / Y: 40 / Z: 80 mm Positioning Accuracy Disp: 0.01mm / Angle: ±0.5°
Applicable Wire Self-bonding (Alcohol/Hot-air) Max Process Size O.D. 45mm / Width 10mm
Power Supply 1Φ 220Vac | 50 ~ 60Hz ±1% Data Storage Memory Card
Power Consumption 4.2KW Air Requirement 0.4 ~ 0.6Mpa
Machine Weight 650kg ±10 Machine Dimensions 1245(L) x 1270(W) x 1825(H)mm
Optional Accessories
CE Certification
Safety Guard
Wire Break Detection
Hot Air Bonding Mechanism
Cold Air blower mechanism
Mold Cleaning Unit
Gravity Discharge Mechanism
Wire hook(press) mechanism
Cutter Mechanism
Tailstock Device
Tension released mechanism